Ripley-Union-Lewis-Huntington Local Schools Board Meeting Agenda April 2026
District To Join High School Tech Internship Program
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Description
The district plans to opt into the High School Tech Internship program administered through Building Bridges to Careers. The program will reimburse 75% of eligible internship costs up to a maximum of $5,000.
Contract Details
Vendor
BUILDING BRIDGES TO CAREERS
Agency
Ripley-Union-Lewis-Huntington Local Schools, OH
Contract Type
PROFESSIONAL_SERVICES
Document Date
April 16, 2026
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Ripley-Union-Lewis-Huntington Local Schools Board Meeting Agenda April 2026
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