National Research Council Canada - Requirement of multiple Lap and Polish Tools - Solicitation 26-58197 (2026)
- Due
- Nov 16, 2026
- 8 days left
- Posted
- Oct 30, 2026
- Primary contact
- Adebisi Adeyeye
- (343) 550-9383
The 30-second brief
The National Research Council Canada (NRC) requires multiple lapping and polishing tools to support the Canadian Photonics Fabrication Centre's (CPFC) modernization to 4-inch wafer processing capability. Procurement items include three Modular Wafer Bonding Systems (Part Number 1MWB8), one LP70C multi-station lapping and polishing machine (Part Number 1LB75), one PP6GT Precision Polishing Jig with Vacuum adaptor (Part Number 1PP62), one CG10 Electronic thickness measurement gauge (Part Number 1CG10), one GI20 Flatness measurement system, and one Solvent Vapour Still assembly for wafer cleaning (Part Number 1SVC2). These semiconductor fabrication tools are critical for producing waveguides, modulators, lasers, filters, and integrated photonic circuits. The submission deadline for statements of capabilities is November 16, 2026, at 2:00 p.m. EST.
Three (3) Modular Wafer Bonding System (Part Number 1MWB8); One (1) LP70C multi-station lapping and polishing system (Part Number 1LB75); One (1) PP6GT Precision Polishing Jig with Vacuum adaptor (Part Number 1PP62); One (1) CG10 Contact Measurement Gauge (Part Number 1CG10); GI20 Flatness measurement system; One (1) Solvent Vapour Still assembly for wafer cleaning (Part Number 1SVC2)
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Summary
The National Research Council Canada (NRC) requires multiple lapping and polishing tools to support the Canadian Photonics Fabrication Centre's (CPFC) modernization to 4-inch wafer processing capability.
Procurement items include three Modular Wafer Bonding Systems (Part Number 1MWB8), one LP70C multi-station lapping and polishing machine (Part Number 1LB75), one PP6GT Precision Polishing Jig with Vacuum adaptor (Part Number 1PP62), one CG10 Electronic thickness measurement gauge (Part Number 1CG10), one GI20 Flatness measurement system, and one Solvent Vapour Still assembly for wafer cleaning (Part Number 1SVC2). These semiconductor fabrication tools are critical for producing waveguides, modulators, lasers, filters, and integrated photonic circuits. The submission deadline for statements of capabilities is November 16, 2026, at 2:00 p.m. EST.
REQUIRED DELIVERABLES
6- Three (3) Modular Wafer Bonding System (Part Number 1MWB8)
- One (1) LP70C multi-station lapping and polishing system (Part Number 1LB75)
- One (1) PP6GT Precision Polishing Jig with Vacuum adaptor (Part Number 1PP62)
- One (1) CG10 Contact Measurement Gauge (Part Number 1CG10)
- GI20 Flatness measurement system
- One (1) Solvent Vapour Still assembly for wafer cleaning (Part Number 1SVC2)
- Submit to
- [email protected]
- Scope location
- Ottawa, Canada
Questions about this RFI
How do I respond to this RFI from National Research Council Canada?
Review the full solicitation document for submission requirements, evaluation criteria, and deadlines. The submission deadline is November 16, 2026. The solicitation specifies required deliverables that must be addressed in your response. Submissions should be delivered to: [email protected]. For questions, contact Adebisi Adeyeye.
Can small businesses or minority-owned firms bid on this RFI?
Most government agencies, including National Research Council Canada in ON, encourage participation from small businesses, minority-owned, women-owned, and disadvantaged business enterprises (MBE/WBE/DBE). Check the full solicitation for any small business participation goals.
What happens after the RFI submission deadline?
After the deadline, the issuing agency reviews all submissions against the stated evaluation criteria. This typically includes a compliance check, technical evaluation, cost analysis, and may involve oral presentations with shortlisted vendors.
Can I ask questions about this solicitation before submitting?
Yes, most solicitations allow vendors to submit questions during a designated period. The primary contact is Adebisi Adeyeye at (343) 550-9383. Questions and answers are typically shared with all prospective bidders.
What are the key deliverables?
The solicitation specifies the following deliverables: Three (3) Modular Wafer Bonding System (Part Number 1MWB8); One (1) LP70C multi-station lapping and polishing system (Part Number 1LB75); One (1) PP6GT Precision Polishing Jig with Vacuum adaptor (Part Number 1PP62); One (1) CG10 Contact Measurement Gauge (Part Number 1CG10); GI20 Flatness measureme. Proposals should clearly address how each deliverable will be met.
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Where can I find more RFPs from National Research Council Canada?
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Is this solicitation still open for submissions?
Based on the posted deadline of November 16, 2026, this solicitation appears to still be accepting submissions. Deadlines may change through amendments or addenda, so always verify the current status directly with the issuing agency before preparing your response.
What documents are required to bid on this RFI?
Requirements vary by solicitation, but common documents include a technical proposal, cost/price proposal, proof of insurance, relevant certifications, past performance references, and any forms specified in the solicitation. Review the full document from National Research Council Canada for the complete list.
What is the scope of this project?
This solicitation defines a specific project scope. The scope covers the following locations: Ottawa, Canada. Review the full solicitation for detailed scope requirements.